
300 mm Double-Sided Wafer Probe System










COUPE™ is a trademark of Taiwan Semiconductor Manufacturing Company (TSMC). All other trademarks are the property of their respective owners.
The MPI TS3000-DS is a double-sided 300 mm automated wafer probe system. It is designed for Silicon Photonics (SiPh) electro-optical device testing and provides true double-sided probing capabilities. Double-sided probing is done by contacting the device electrically from one side and aligning optical fiber arrays from the opposite side of the wafer, which is required as an example for TSMC COUPE™ Technology.
The TS3000-DS enables reliable characterization with an optical alignment repeatability of 0.1 dB across a wide range of device structures. It offers temperature testing from ambient to 150°C.
The system accommodates 6-axis positioner for precision optical alignment supporting multiple grating and edge type coupling methods. Probe cards with high-pin-count configurations are supported as well as digital high-speed testing up to 250 GHz.
Features & Benefits
- Electrical probing from the top and optical from the bottom of the wafer
- Supports COUPE™︎ and standard electro-optical wafer types
- Integrated Z-distance sensor for precise optical probe positioning
- Optional Probe-To-Pad-Alignment (PTPA) for vertical probe cards
- Temperature test range from +35 to +150 °C
- Customized backside opening according to 300 mm wafer layout
- Strong vacuum for handling partially warped wafer stacks
- Repeatable optical probe alignment over temperature
Optical
- High precision and ultra-fast optical probe alignment
- Fiber coupling for grating and edge type devices
- Positioner configurations in east and west
Electrical with High Pin Count
- Probe card in 4.5-inch width and round format
- Optional vertical probe cards with up to 10.000 pins
- Variety of individual DC and RF MicroPositioners
As a market leader in RF and MMW, MPI enables accurate high-speed measurements up to 250 GHz
The fully integrated hardware control panel enables fast and accurate system configuration and control. The strategically positioned keyboard and mouse facilitate system operation and control of the Windows 11-based instrumentation. A front-facing USB port is conveniently located for easy access and data exchange.





Software & Control
MPI automated engineering probe systems are controlled by the unique and revolutionary SENTIO® Software Suite, featuring multitouch operation. Its simple and intuitive interface significantly reduces training time. Scroll, zoom, and move commands mimic those of modern smart devices, allowing users to become proficient in just minutes. Switching between the active application and other apps is as easy as a simple finger swipe.
Necessary optical alignment stages, such as the hexapod, are fully integrated into the SENTIO® probe station control software. They are operated just like any other automated positioner, including additional automated optical alignment features. The integration goes beyond the multi-touch software, making electro-optical device measurements easy to perform.
SENTIO® offers additional useful functions for measurements on photonic integrated circuits. For example, setup wizards guide the user through the configuration process, and the integrated SmartFence™ enables safe and convenient manual fiber navigation.
Different fiber probe types are managed via the graphical user interface, allowing a wide variety of integrated photonic devices to be tested conveniently. To support easy test executive integration, MPI provides a comprehensive remote command set covering all necessary operations for automated testing.
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TS200
TS300
TS150-THZ
TS200-SE
TS150
TS200-THZ
TS300-SE
TS2000-SE
TS3000
TS3000-SE
SiPH Probe System
TS2000
TS2000-IFE
TS150-HP & TS200-HP
TS2000-DP Probe System
TS2000-HP Probe System
TS3000-HP
TS3500-HP
TS2500-DP
TS3500-SE with WaferWallet®
TS2000-IFE with WaferWallet®MAX
TS2500 Series
TS2500-SE
チャックシステム
マイクロポジショナ
DC、RFプローブアーム
顕微鏡
レーザ・カッタ
TITAN™ RFプローブ
RF校正ソフトウェア
RF Calibration Software
RFアクセサリ
校正基板
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