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Failure Analysis (FA)

Failure Analysis (FA)

MPI Definition

Root cause identification of failing devices (e.g. field returns or new designs) is essential for all semiconductor manufacturers and design houses.

Major Requirements

There are several major fragments in this process:

  • Verification of electrical, functional failure based on leakage or simple open/short measurements
  • Failure localization with typical hot spot and emission analysis, laser cutting and internal node probing down to submicron level
  • Physical failure analysis based on submicron probing or on SEM, TEM, EDX, AFM tools
  • Micro-motion analysis is one additional set of measurements on wafer level, specifically related to MEMS devices
  • 10 kV test environment for failure analysis on high power devices

Failure Analysis

MPI Solutions

MPI Test Solutions for FA applications come with everything needed to achieve accurate measurement results in the shortest time, with maximum confidence. The highly stable Engineering Probe Systems and highly accurate MicroPositioners provides best solution for electrical failure verification, localization and debugging. With the vibration isolated environment and wide zoom & high magnification microscopes provide the ability to probe the structure as small as one micron.

 

MPI TS3000 probe systems, offer uniquely the simultaneous use of probe cards and MicroPositioners (DUT driving & internal signal measurements), especially at temperatures down to negative 60°C.

The low platen to chuck distance makes the Picoprobing very convenient.

 

The unique MPI Laser Cutter System LCS-635 is designed for accurate and reliable Failure Analysis and variable configurations based on 1064 nm, 532 nm, 355 nm or 266 nm wavelengths provides the capability to remove several semiconductor materials and metals selectively.

 

MPI Engineering Probe Systems are easily configured with emission microscopes such as from Hamamatsu Photonics Japan to detect and localize the IC failures. In addition, the TS150/TS200-HP probe systems are the ideal choice for the equivalent analysis of High Power devices up to 10 kV and 600 A.