MPI America Inc. Agrees to Acquire Celadon Systems Inc.

San Jose, CA August 26th, 2021 – MPI America Inc, a wholly owned subsidiary of MPI Corporation Taiwan, and recognized globally as a leader in semiconductor test, is pleased to announce that it has entered into a definitive agreement to acquire Celadon Systems Inc, the market leader in ultra-high performance semiconductor test probe cards. The purchase of Celadon Systems will advance MPI’s presence in the wafer test marketplace and is a continuation of demonstrated market leadership in developing numerous innovations while serving customers in all aspects of the semiconductor wafer test market. The acquisition is expected to be completed early September, 2021, subject to the satisfaction of customary closing conditions.

“We have recognized the work of the Celadon team over many years now,” says Rob Carter, President of MPI America Inc., “and are honored to include their prowess to the MPI offering. With the cross-pollination of technologies and talent, we are providing an even higher level of value to our combined clientele. Together, we are focused on market needs with the products and services that make our customers even more competitive.”

“After years of successfully partnering to find solutions to our customers’ most demanding challenges, the Celadon Team is excited to now join the highly respected industry leader, MPI Corporation family and more specifically MPI America, Inc.”, says Karen Armendariz, President and CEO of Celadon Systems, “There is a natural fit and synergy between our organizations, from our core competence to our product catalogs. Both companies are dedicated to serving our customers and together we will bring forward the complete solution our customers have always desired.”

As the founders and owners, Bryan and Valerie Root added “We wanted to find a buyer that would complement Celadon’s admired company culture and customer focused values as well as build on its’ successful growth. Knowing the folks at MPI for as many years as we have, it is an easy fit as we transition to our next phase in life.”

About MPI Corporation

Founded in 1995 and headquartered in Hsinchu, Taiwan, MPI Corporation is a global technology leader in Semiconductor, Light
Emitting Diode (LED), Photo Detectors, Lasers, Materials Research, Aerospace, Automotive, Fiber Optic, Electronic Components and more. MPI’s four main business sectors include Probe Card, Photonics Automation, Advanced Semiconductor Test and Thermal Divisions. MPI products range from various advanced probe card technologies, probers, testers, material handlers, inspection and thermal air systems. Many of these products are accompanied by state-of-the-art Calibration and Test & Measurement software suites. The diversification of product portfolio and industries allows a healthy environment for employee growth and retention. Cross pollination of product technologies allows each new innovation to provide differentiation in areas that are meaningful to our precious customer base. For more information please visit: www.mpi-corporation.com

About Celadon Systems Inc.

Celadon Systems, Inc., The Home of Peace of Mind Probing, was founded 1997 by Bryan and Valerie Root and is headquartered in Burnsville, Minnesota. Celadon Systems is focused on the design and manufacturing of advanced probe card solutions and high-performance cables. Celadon Systems is a global leader in parametric test, wafer level reliability, modeling, characterization, cryogenic applications, and high-power probe cards for the semiconductor industry. As an industry leading, on-wafer probing solutions provider, Celadon’s reputation for delivering ultra-high performance probe cards that thrive in extreme temperatures is unparalleled. Celadon seeks to enrich the lives of our customers, employees, and community partners by offering a challenging, inspiring, and empowering environment that drives strong
and profitable growth. For more information, please visit:
www.celadonsystems.com

Contact:
Rob Carter
Karen Armendariz

MPI Advanced Semiconductor Test Division (AST) in New Facility

MPI’s Advanced Semiconductor Test Division (AST) proudly announces a move into a new 5-floor facility located next to the original MPI Corporate Headquarters in Hsinchu, Taiwan. The expansion is a necessary and significant step as a result of MPI’s growth over the last several years.

Hsinchu, Taiwan, February 1, 2021 – MPI Corporation’s Advanced Semiconductor Test Division, a leading provider of accurate and innovative wafer level test solutions for the semiconductor industry, is moving into a new facility in Hsinchu, Taiwan. MPI Corporation is responding to increased industry demand for its semiconductor test equipment due to growing technology inflections points such as 5G wireless, artificial intelligence and machine learning.

“We are very pleased to announce the opening of a new facility,” says Scott Kuo, CEO of MPI Corporation. “This is not only an opportunity to bring our relatively new Advanced Semiconductor Test and Thermal Divisions directly within the MPI corporate park, but it also allows us to further expand our manufacturing capabilities and meet the growing needs of the semiconductor test market.”

The new Advanced Semiconductor Test facility plant comprises over 90,000 square feet, along with several areas designated for office, production, application, demonstration, training center and a first floor loading dock.

“Our team could not be prouder of the achievements these past few years, as the Advanced Semiconductor Test Division became an undisputed innovation and a market leader in several segments within our served available market,” says Dr. Stojan Kanev, General Manager of the Advanced Semiconductor Test Division. “In our new production site, the division will achieve even greater flexibility to meet customer demands, such as accelerated support, delivery and overall response times.”

The new location has begun operation, and the first systems will be delivered to customers starting in January 2021.

 

About MPI Corporation

Founded in 1995 and headquartered in Hsinchu, Taiwan, MPI Corporation is a global technology leader in Semiconductor, Light Emitting Diode (LED), Photo Detectors, Lasers, Materials Research, Aerospace, Automotive, Fiber Optic, Electronic Components and more. MPI’s four main business sectors include Probe Card, Photonics Automation, Advanced Semiconductor Test and Thermal Divisions. MPI products range from various advanced probe card technologies, probers, testers, material handlers, inspection and thermal air systems. Many of these products are accompanied by state-of-the-art Calibration and Test & Measurement software suites. The diversification of product portfolio and industries allows a healthy environment for employee growth and retention. Cross pollination of product technologies allows each new innovation to provide differentiation in areas that are meaningful to our precious customer base.

 

For more information please visit: mpi-corporation.com

MPI Corporation at INMMiC 2020

The International Workshop on Integrated Nonlinear Microwave and Millimetre-wave Circuits (INMMiC), July 16-17, 2020 – Virtual Conference

This week MPI participated at INMMiC 2020 virtual conference hosted online with IEEE. Here is the video describing MPI’s products and expertise showing how our systems have been developed to address in the field of nonlinear microwave and millimetre-wave circuits and systems.

ERS electronic adds PRIME 200 to their AirCool® thermal chuck family

ERS electronic adds PRIME 200 to their AirCool® thermal chuck family

ERS electronic and MPI Corporation are now offering a 200 mm version of their popular thermal chuck AirCool® PRIME.

 

MUNICH, MAY 14th, 2020 – ERS electronic GmbH, the industry-leading manufacturer of thermal management solutions for the semiconductor market will offer its customer-favorite AirCool® PRIME for 200 mm wafer format.
Following the success of the 300 mm version, the innovation leader has added a 200 mm counterpart, promising the same performance in a smaller form factor.

The cutting-edge PRIME technology is the result of collaboration with prober manufacturer MPI Corporation and was rolled out in beginning of 2018. Two years later, thanks to PRIME’s many unique features lowering the cost of test without compromising performance, it remains at the forefront of thermal testing technology. Among the unique features are ultra-low noise (ULN) capability in the single-digit Femto-Ampere (fA) range along with the industry’s shortest soak time.

The system can be configured for temperatures ranging from -65°C to 300°C and is ideal for testing both high frequency and high voltage applications. Through the PRIME Thermo Shield (PTS) and a unique “mini-environment” around the wafer, the transition times and stabilization time after temperature change have been significantly reduced, resulting in shorter overall test times.

The AirCool® PRIME 200 is predicted to become a popular format for new materials like Silicon Carbide (SiC). It is easy-to-use, has a changeable top plate and includes several upgrade paths in temperature and vacuum surface configurations.

“MPI is excited to offer the 200 mm PRIME technology with the most versatile thermal range and built-in field upgradability. The system covers various applications including, but not limited to, ultra-low noise, 1/f, RTN, RF, mmW and high-power accurate measurements,” says Stojan Kanev, General Manager of MPI Corporation’s Advanced Semiconductor Division. “Another great example of lowering the cost of test, reducing footprint, soak time and keeping the CDA consumption for the whole system (chuck + prober) lower than other systems in the market. This ultimately demonstrates the power behind MPI and ERS in developing customer-oriented solutions.”

“We are very proud to see that the PRIME technology has become a favorite in the thermal test industry, and is being widely used for wafer probing of connectivity and electromobility devices. Adding the 200mm version will help accelerate market growth,” says CEO Laurent Giai-Miniet. “The analytical wafer probing market remains the most challenging space in wafer test, and is the main target for ERS innovation. Working with MPI Corporation has been instrumental in bringing advanced Thermal Solutions to the market.“

The PRIME 200 chucks can be ordered for all MPI 200 mm manual, automated and fully-automated probe stations.

 

About ERS:

ERS electronic GmbH, based around Munich, has been producing innovative thermal
test solutions for the industry for nearly 50 years. The company has gained an outstanding reputation in the sector, notably with its fast and accurate air cool-based thermal chuck
systems for test temperatures ranging from -65°C to +550°C for analytical, parameter-related
and manufacturing tests. Today, thermal chuck systems developed by ERS such as AC3, AirCool® PRIME, AirCool® and PowerSense® are integral components in all larger-sized
wafer probers across the semiconductor industry.

 

For more information, please visit: https://www.ers-gmbh.com/

 

About MPI Corporation:

 

Founded in 1995 and headquartered in Hsinchu, Taiwan, MPI Corporation is a global technology leader in Semiconductor, Light Emitting Diode (LED), Photo Detectors, Lasers, Materials Research, Aerospace, Automotive, Fiber Optic, Electronic Components and more. MPI’s four main business sectors include Probe Card, Photonics Automation, Advanced Semiconductor Test and Thermal Divisions. MPI products range from various advanced probe card technologies, probers, testers, material handlers, inspection and thermal air systems. Many of these products are accompanied by state-of-the-art Calibration and Test & Measurement software suites. The diversification of product portfolio and industries allows a healthy environment for employee growth and retention. Cross pollination of divisional product technologies stimulates MPI product innovations that are meaningful to our precious customer base. MPI is the first TPEx listed probe card company in Taiwan.

 

For more information, please visit: www.mpi-corporation.com

MPI Corporation at ICMTS 2020

33rd IEEE International Conference on Microelectronic Test Structures (ICMTS), May 4-17, 2020 – Virtual Conference

This week MPI participated at ICMTS 2020 virtual conference hosted online with IEEE. Here is a short video introducing MPI’s products and expertise showing how our systems have been developed to address a wide range of challenges surrounding device characterization and measurement analysis.

MPIが1/f雑音およびRTN測定用のNoiseShield™オプションを発表

台湾, 2019、9月18日 – MPI Corporation社はNoiseShield™ オプションを発表した。 このオプションではEMIシールディングの強化をはかり、低インピーダンスでのグランディングを実現し、かつケーブル長を短くして、寄生容量の削減をはかり、測定系のロールオフ周波数も最大化しています。 このオプションにより、外部磁界の影響を少なくして、1/f, RTNの測定を安定かつ設置場所に関係なく正確に行えるようになりました。プローブ・ステーションの影響をほぼ透明化して、測定器の限界値までの測定が可能になりました。

「MPIのNoiseShield™は1/f測定において、付加価値の高いソリューションを提供します。」とMPI 社AST事業部、デバイス・モデリング・ディレクター、Toe Naing Sweは言います。「MPI社 のShielDEnvironment™ と組みあわせることにより、被測定物(DUT)および測定器(例えばProPlus9812DXプレアンプ、付属するケーブル/コネクタも含む)に対して優れたEMIシールディング効果を発揮します。この統合ソリューションではLNAをDUTの近くに置くことにより、使用するケーブルを短くしています。MPI社の TS3500-SE WaferWallet®付きフルオート・プローバにより、1/f測定のオンウエハでの完全自動測定が可能です。 MPI社 のSENTIO® ソフトウェアには ProPlus Design Solution, Inc. 社のソフトウェア BSIMProPlus™ およびNoiseProPlus™ 用ドライバが用意されており自動測定システムを容易に構成できます。」

「MPI社のプローバは私が今まで経験したプローバで最も優れた特性を持っています。」とProPlus Design Solution, Inc.社のCEO(共同設立者)、Dr. Zhihong Liu氏は言います。「ノイズ測定においてはシールディングおよび寄生分の削減が重要ですが、その点、このプローバは最も優れた特性を持っています。これにより、トレード・オフなしで我々の測定器の持つ限界値までの測定が可能となりました。9812DXの精密型LNA を使用することにより、 3e-27 A^2/Hz ( >20KHz 帯域幅)までの雑音レベルの測定が可能となり、バイアス電流をpAレベルまで正確にモニターできるようになりました。さらに、機械的振動の影響を受けずに、低周波側は0.1 Hzまでの測定が実現されました。MPI社プローバを用いてMOSFETを10MHzまで測定したときの雑音レベルは使用しているLNAの雑音レベルと同等のノイズレベルであることを確認しました。」

MPI Corporation社について

MPI社は1955年に設立され、本社を台湾新竹市に置く会社です。半導体、LED、光検出器(フォトデテクター)、レーザー、半導体材料、航空宇宙、光関連、電子部品など様々な分野でテクノロジー・リーダとしての地位を確立してきました。MPI社はProbe Card、Photonics Automation、Advanced Semiconductor Test、Thermal Testの4つの事業部で構成され、製品は最先端プローブカード、プローバ、テスター、半導体搬送装置、温度環境試験装置など多岐にわたります。また、これらには最高水準の制御ソフト、校正ツールが装備されています。幅広い製品ポートフォリオに従事することにより、従業員の育成に適した健全な環境を提供しています。事業部間の技術交流はイノベーションを促進し、お客様に優れたソリューションを提供いたします。

MPIに関する詳しい情報はこちらのウエブサイトを参照ください: www.mpi-corporation.com

ProPlus Design Solution, Inc.社について

ProPlus Design Solutions, Inc.社は設計と製造を密接に関連づけるEDA(Electronic Design Automation) ソリューションを提供する会社です。ナノスケールSPICEモデリングの最先端プロバイダーであり、 ギガスケールSPICEシミュレーションおよびDFY(Design for Yield)アプリケーションを提供しております。SPICEのゴールデンモデリング・プラットフォームを提供し、業界で唯一のGigaSPICEシミュレータおよびDFY設計プラットフォームを提供しています。 ProPlus Design Solutions社は2006年に設立され、R&Dセンターを米国のSan Jose、中国の北京、 済南に持っています。また、日本の東京、台湾の新竹、中国の上海にオフィスを持っています。

ProPlus Design Solution, Inc.社の詳しい情報はこちらのウエブサイトを参照ください: www.proplussolutions.com

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